In the past, after companies such as Qualcomm and MediaTek invested in TSMC, they were required to shift from wafers to testing plant packaging for ASE and SPIL.

Furthermore, in order to allow clients to go through just one window, TSMC shortened the process time for all client products prior to delivery. As a result, TSMC has decided to strengthen its own packaging capacity.

Currently, TSMC has already launched low-cost CoWoS packaging solutions that integrate multi-chip integrated fan out (InFO) with three-dimensional integrated circuit (3D IC).

Not long ago, TSMC Senior Vice-President and Head of Finance, He Li-mei announced that next year TSMC’s packaging capacity investments will exceed ten billion dollars. Following CoWoS, TSMC will next year drastically increase its InFO operations. TSMC has great confidence in this technology.