However, Samsung has adapted 10nm FinFET in its semiconductor manufacturing process roadmap, and presumed to begin volume production by the end of 2016.

Meanwhile, TSMC will start producing the A9 processors sometime before the end of the year that will also produce new fingerprint scanners alongside audio chips for Apple's next iPhone devices. Mac Rumors reports.

Furthermore, Apple Insider has reported that new images of Apple's iPhone 6S Plus have been leaked by Future Supplier. The new images show the gold-colored case of iPhone 6S Plus on the back. And the iPhone 6S Plus apparently comes with a stronger material than its predecessor, the iPhone 6 Plus.

Apart from that, Samsung Electronics Taiwan Co. on July 23 said it had appointed Gary Tsao to serve as general manager of the company’s information technology and mobile communication team.