Taipei, Monday, Aug 03, 2020, 20:45

News

ASE to Showcase SiP and MEMS & Sensor Solutions at COMPUTEX 2016

Published: May 30,2016

TAIPEI, Taiwan - Advanced Semiconductor Engineering(ASE) today announced that it will showcase System-in-Package (SiP) and MEMS & Sensor technologies through live demonstrations of Smart Living and Smart Bike applications at COMPUTEX 2016.

More on This

ASE Technology Holding Joins Apple’s Supplier Clean Energy Program

TAIPEI, Taiwan - ASE Technology announced today that it has joined the Apple Supplier Clean Energy Program. As a leading semiconductor packaging...

ASE Shares Experience with Lights Out Factories

TAIPEI, Taiwan - In order to promote the smart transformation and upgrading of Taiwan's manufacturing industry and enabl...

SiP technology is an ideal solution for a broad spectrum of consumer technology. With its ability to enable multiple semiconductor chips and passive components to be integrated within increasingly more compact modules, without compromising functionality, SiP is perfectly suited for IoT applications.

Additionally, visitors will be able to see a live Smart Bike demo in which ASE will showcase how its SiP platform can enable smart biking through a city. The demo will feature traffic light control optical sensing, motion sensing and heart rate and oxygen saturation detection, among other technologies.

ASE’s advancements in SiP technology serve to meet growing market demand for low-powered controllers and sensors with small footprints but large memory for continually shrinking devices. Enabling heterogeneous integration of numerous IC functions — such as RF, processor, memory, sensors, power, multimedia and more — within very tight space constraints.

CTIMES loves to interact with the global technology related companies and individuals, you can deliver your products information or share industrial intelligence. Please email us to en@ctimes.com.tw

609 viewed

comments powered by Disqus