After entering operation, this iconic plant will strengthen the technical abilities of its related supply chain in China including ICs design, ICs packaging and equipment services, and further lift China’s semiconductor industry to another level.

TSMC is currently the best IC foundry in terms of market share and process technology, it attracts global leading semiconductor companies around it for developing latest IC products.

The main goal of this 12-inch wafer fab is to fulfill the needs of TSMC’s China customers, where smartphones, automotive electronics and IoT applications are booming, will pull worldwide related IC companies to follow its step and setup offices around it for deepening China market.

Global leading IC design firms, IC packaging/ testing services providers, and equipment suppliers will establish a tight supplier chain for TSMC’s Nanjing 12-inch fab, which will accelerate the development of infrastructure and talent cultivating, further lifting the growth of China’s semiconductor market and technology.

Especially under the China-made policy, Chinese government will put into more resources to help forming this industry cluster, where the Tsinghua Unisplendour Group and Acetec Semico-nductor has already located.

TSMC Chairman Morris Chang personally attended the ground-breaking ceremony, accompanied with several high-ranking Chinese government and Communist Party officials, including Jiangsu Provincial Party Secretary Li Qiang, also attended the ceremony.