Taipei, Wednesday, Mar 29, 2017, 21:21

News

Rambus Signs Patent License Agreement With Winbond

Published: Jan 17,2017

Rambus Inc. today announced it has signed a broad five-year patent license agreement with Winbond Electronics Corporation, a worldwide leading supplier of specialty memory. This agreement covers the use of Rambus patented memory solutions, including server DIMM chipsets, for Winbond products through 2021.

More on This

Winbond's 3x-nm DRAM to Begin Mass Deliveries in Q3 2017

TAIPEI, Taiwan - Taiwanese memory manufacturer Winbond yesterday at a corporate briefing session announced that Windbond...

Winbond Introduces First SpiStack Memories in 8-Pin Packages

Winbond Electronics Corporation today announced a expansion of its flash product portfolio with the introduction of a family of stackable SpiFlash memories...

“In today’s data intensive applications, computing memory solutions must be more efficient, deliver higher levels of bandwidth and lower latency to solutions to meet the demands of the market,” said Luc Seraphin, general manager of the Interface Division at Rambus. “This collaborative partnership with Winbond provides critical memory and interface technologies that address the needs and requirements to run effective data centers.”

Rambus develops high-performance, low-power memory and SerDes interface chips and IP cores to meet the needs of increasingly diverse enterprise and mobile applications. Rambus also drives innovations in silicon-to-cloud security, making digital products safer and better.

CTIMES loves to interact with the global technology related companies and individuals, you can deliver your products information or share industrial intelligence. Please email us to en@ctimes.com.tw

611 viewed

comments powered by Disqus