Samsung Electronics announced that it broke ground on a new EUV (extreme ultraviolet) line in Hwaseong, Korea, aiming to...
Samsung Electronics announced that it has begun mass producing the industry’s largest capacity Serial Attached SCSI (...
Through further scaling from the earlier 14LPP process, 11LPP delivers up to 15 percent higher performance and up to 10 percent chip area reduction with the same power consumption.
In addition to the 10nm FinFET process for mobile processors in premium flagship smartphones, the company expects its 11nm process to bring differentiated value to mid- to high-end smartphones.
The new process technology is scheduled to be ready for production in the first half of 2018.
Samsung also confirmed that development of 7LPP with EUV (extreme ultra violet) lithography technology is on schedule, targeting its initial production in the second half of 2018.
Since 2014, Samsung has processed close to 200,000 wafers with EUV lithography technology and, building on its experience, has recently seen visible results in process development such as achieving 80 percent yield for 256 megabit (Mb) SRAM (static random-access memory).
“Samsung has added the 11nm process to our roadmap to offer advanced options for various applications,” said Ryan Lee, Vice President and Head of Foundry Marketing at Samsung Electronics. “Through this, Samsung has completed a comprehensive process roadmap spanning from 14nm to 11nm, 10nm, 8nm, and 7nm in the next three years.”
CTIMES loves to interact with the global technology related companies and individuals, you can deliver your products information or share industrial intelligence. Please email us to email@example.com
- 1NDRC and Samsung Are Said to Be Signing MOU, which Could Moderate DRAM Price Rises, Says TrendForce
- 2Winbond: DRAM and Flash to Remain Stable in 2018
- 3Groundbreaking for TSMC 5nm Factory Estimated for 2020
- 4Shipments of Gaming Monitors to Grow by 40% in 2018, Says TrendForce
- 5Innolux’s AM miniLED Panels to be Mass Produced in Two Years