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Taiwan's ITRI Showcases Flexible Fan-out Panel Level Packaging Technology at SEMICON Taiwan

By Korbin Lan
Published: Sep 14,2017

TAIPEI, Taiwan - Fan-Out Wafer Level Packaging technology can package different die in one chip, is a key technology of the development of ultra-thin devices. Taiwan's Industrial Technology Research Institute(ITRI) showcased its flexible Fan-Out 3 Layers RDL panel level packaging technology at this year's SEMICON Taiwan, which not only can reduce the thickness of chip and power consumption, but also can increase the output of chip packaging.

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ITRI's flexible Fan-Out 3 Layers RDL panel level packaging technology is based on its own FlexUP soft substrate and core flexible display technology, can be applied to the existing LCD panel process.

Eric Hao, Division Director of Display Technology Center of ITRI, said that Fan-Out packaging technology can integrate different dies in the wafer level, which is ideal IC manufacturing solution for RF and wireless IC integration, and application processor and baseband IC integration. It is an important technology in developing smartphone and IoT devices.

As for the use of rectangular panel-level process is to enhance the wafer package production. Eric Hao explain that the rectangular panel-level process can be deployed directly on the existing 2.5-generation LCD panel process, where the cost of equipment installing is very low. Meanwhile, compared to the traditional round process, rectangular process can also enhance the production capacity of about 5% due to the wafer cutting method.

Eric Hao pointed out that including Samsung Electronics is in the development of this rectangular panel-level process technology.

In addition, because ITRI uses the flexible substrate to reach foldable ability, which expands the scope of usage, can be applied to wearable devices and soft electronic applications.

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