Taipei, Friday, Mar 29, 2024, 09:54

News

VIA Launches VIA SOM-9X20 Featuring Qualcomm Snapdragon 820 Embedded Platform

Published: Oct 26,2017

TAIPEI, Taiwan - VIA Technologies, Inc., today announced the launch of the VIA SOM-9X20 system-on-module (SoM) powered by the Qualcomm Snapdragon 820 embedded platform.

More on This

DSP and Language Libraries are the Keys to Smart Voice

The success of the Amazon Echo has changed the entire style of the smart voice application market, and now when people discuss smart voice...

VIA Unveils Edge AI System Line for Automotive, Enterprise IoT, and Smart City Applications

TAIPEI, Taiwan - VIA Technologies, Inc., today showcased its family of high-performance Edge AI systems for the Automotive...

The VIA SOM-9X20 is an ultra-compact SoM that harnesses the leading-edge performance and low power consumption of the Snapdragon 820 embedded platform to provide a highly-flexible solution for enabling the rapid development of a variety of Enterprise IoT and embedded system applications ranging from human-machine interface (HMI), surveillance, and digital signage to robotics, cameras, and video conferencing.

“Combining cutting-edge computing, graphics, and video capabilities with advanced wireless connectivity and low power consumption, the Snapdragon 820 meets the exacting performance and power efficiency requirements of next-generation Enterprise IoT and embedded devices,” said Richard Brown, Vice-President of International Marketing, VIA Technologies, Inc.

“The VIA SOM-9X20 is designed to enable our customers to accelerate the development of groundbreaking new products with stunning 4K video capabilities for rapidly-emerging applications such as machine intelligence, computer vision, and Augmented and Virtual Reality.”

“The Snapdragon 820 embedded platform provides the performance, energy efficiency, and connectivity required in cutting-edge Enterprise IoT devices,” said Jeffery Torrance, vice president, business development, Qualcomm Technologies, Inc.

“We are delighted that VIA is making the power of Snapdragon available in an ultra-compact SoM that will help developers quickly create new and exciting commercial IoT systems, scenarios, and use cases.”

CTIMES loves to interact with the global technology related companies and individuals, you can deliver your products information or share industrial intelligence. Please email us to en@ctimes.com.tw

1310 viewed

Most Popular

comments powered by Disqus