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Dow Expands Jhunan CMP Technological Center to Increase Capacity of CMP in Taiwan

Published: Apr 03,2018

TAIPEI, Taiwan - Dow Electronic Materials, a business unit of DowDuPont's specialty products division, held a ribbon-cutting ceremony for its phase four expansion at its Asia Chemical-Mechanical Planarization (CMP) manufacturing and technical center in Jhunan. The new plant will expand the production of pads for chemical mechanical planarization.

Liang-Gi Chen, the leader of science department said that Dow Electronic Materials provides the technology of CMP, advancing the semiconductor production process in Taiwan. Dow is one of the best semiconductor front-end process companies in the world, who takes an important role in the semiconductor production process. Therefore, the government will positively support the infrastructure construction, also cultivating talents, and capture up-and down-stream manufacturers to invest in Taiwan.

"Opening of phase four expansion is our vision for years. Twelve years ago, the place was still a scene of desolation, however, with the augment of needs from companies and customers, we expanded plants. We will also provide the investment of the phase five expansion if there is the need in the future. Thanks to customers and the government for many years of support." Stated Mario Stanghellini, Vice President and Global Business Director, Semiconductor Technologies, Dow Electronic Materials.

"Expanding our investment at Asia CMP center facilitates us to meet customer needs in the future by making good use to the strong infrastructure and talented team we have in Taiwan."

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