Keysight Technologies announced an extended collaboration with AAC Technologies (AAC), a leading provider of advanced miniaturized technology...
Keysight Technologies announced the MX0023A InfiniiMax RC, a new high speed differential probing solution for Double Data Rate 5 (DDR5) and Low Power Double Data Rate 5 (LPDDR5)...
Integrated photonics, also called silicon photonics, is a revolutionary technology that multiplies data transfer capacities while reducing power consumption and cost. While photonics integrated circuits (PICs) offer an exciting alternative to the limitations of traditional data center networking, they also introduce new design and test challenges for component and device manufacturers. Adoption of PICs is primarily dependent on an industrial ecosystem comprised of new foundries, commercial modeling tools and photonic test capabilities.
Keysight, FormFactor and CompoundTek, have jointly developed an advanced photonics on-wafer testing solution that delivers industry-first capabilities including automated alignment, simultaneous optical-optical and optical-electrical device tests.
Silicon photonics also delivers benefits for industrial segments such as intra data center communication and data center interconnects (DCI), telecom, 5G and automotive connectivity, high-performance computing, light detection and ranging (LIDAR), as well as sensing and medical applications.
“Innovation in optics is critical to connect the world and help the industry to monetize 5G, as well as data center and telecom services,” said Dr. Joachim Peerlings, vice president of Network and Data Center Solutions at Keysight Technologies. “Advancing in speed as well as power and cost efficiency requires a tightly connected eco-system to jointly solve the challenges ahead. We are pleased with our partnerships and progress of enabling this eco-system through our unmatched photonics test expertise.”
CompoundTek plans to establish a state-of-the-art silicon photonics testing services hub in Singapore. The company’s chief operating officer, K.S. Ang, commented, “With added on-wafer level, automated Si photonics Optical/Electrical/RF testing with this solution, customers will be able to limit packaging costs to avoid module packaging level testing turn-around time losses. This test solution complements our current services in mass production volume with fast cycle-time, offered alongside world-class commercial foundry capabilities that accelerate time-to-market to achieve customers’ commercialization goals.”
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