ROHM and STMicroelectronics today announced it signed a multi-year silicon carbide (SiC) wafers supply agreement with SiCrystal...
Tieto and STMicroelectronics announced their collaborative efforts to develop Central Control-Unit (CCU) software to run on STMicroelectronics’ popular Telemaco3P platform...
“At a time of constrained global capacity for silicon carbide, the full acquisition of Norstel will strengthen our internal SiC ecosystem: it will boost our flexibility, allow us to control better the improvement of yield and quality of the wafers, and support our long-term silicon carbide roadmap and business,” said Jean-Marc Chery, President and CEO of STMicroelectronics. “This acquisition comes in addition to wafer supply agreements signed with third parties, with the overall goal to secure the required level of wafers to manufacture MOSFET and diodes for the automotive and industrial customer programs that will ramp up over the next years.”
Norstel will be fully integrated into ST’s global R&D and manufacturing operations. It will continue growing its activities covering both the production of 150mm bare and epitaxial silicon carbide wafers and R&D on 200mm production as well as, more broadly, on wide bandgap materials.
CTIMES loves to interact with the global technology related companies and individuals, you can deliver your products information or share industrial intelligence. Please email us to email@example.com
- 1Keysight, AAC Technologies Extend Collaboration to Accelerate 5G Antenna Solutions
- 2First-time Reported Nanoporous Carbon Material for High-efficient Capacitive Deionization
- 3Taiwan Tech Arena Win 13 Innovation Awards at CES 2020
- 4Ambarella Collaborates with AWS on Single-click Machine Learning for Edge Applications
- 5US Concentrates on Smart Medical Imaging System Patents Related to Image Processing-Image Analysis