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SiP and Heterogeneous Integration as Key Driving Force of Growth for IC Packaging and Testing

Published: Feb 03,2020

TAIPEI, Taiwan - Amid continued economic uncertainty and high inventory levels, growth of the worldwide IC packaging and testing industry is expected to slow down, and the worldwide IC packaging and testing industry shipment value is estimated to reached US$29.757 billion, up merely 0.99% year-on-year in 2019, according to Taipei-based government-backed IT research institute MIC (Market Intelligence & Consulting Institute).

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“Due to increased complexity at the system level, logic ICs require more advanced manufacturing processes. For this reason, RF ICs and I/O controller ICs are packaged with different manufacturing processes and then integrated using SiP technology,” said Wen Liu, industry analyst at MIC.

"Driven by the development of the IoT, vendors have incorporated additional acceleration engines such as memory, GPUs, vision CPUs, and machine learning processors in their SiP or SoC solutions to enhance chip performance. Given that heterogeneous integration has a direct impact on chip performance, wafer foundries have also expanded their services into this area. Therefore, OSAT companies have to compete with existing players as well as wafer foundries."

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