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Toshiba to Unveil Low Voltage 5GHz Receiver for Next-Generation Wireless LAN
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Published: Sep 18,2017
Finance Is Moving to the Cloud Much Faster Than Expected, Gartner Says
According to Gartner, Inc. A recent Gartner survey of senior finance executives found that by 2020, 36 percent of enterprises will use the cloud to support more than half of their transactional systems of record. Gartner sur...
E Ink, Ueberall and the San Diego Airport to Introduce the World’s Largest e-Paper Media
E Ink Holdings, Ueberall International, and the San Diego International Airport, unveiled DAZZLE, a monumental public artwork featuring the largest deployment of E Ink’s Prism technology. Located at the San Diego International Airport’s new Rental Car Center...
Toshiba to Realize to the World’s Fastest Quantum Key Distribution Device
Toshiba Corporation and Toshiba Research Europe Limited’s Cambridge Research Laboratory in the UK have brought the enhanced security of quantum cryptography closer to practical realization with development of the world’s fastest quantum key distribution device...
Strong Chinese Market to Push Annual Global Photovoltaic Demand, Says TrendForce
China will again take the leading share of the total annual photovoltaic (PV) demand worldwide in 2017, says the latest Gold Member Solar Report by EnergyTrend, a division of TrendForce. China’s solar demand for this year has surpassed earlier expectations due to the surging installations of distributed PV systems...
Taiwan's ITRI Showcases Flexible Fan-out Panel Level Packaging Technology at SEMICON Taiwan
TAIPEI, Taiwan - Fan-Out Wafer Level Packaging technology can package different die in one chip, is a key technology of the development of ultra-thin devices. Taiwan's Industrial Technology Research Institute(ITRI) showcased its flexible Fan-Out 3 Layers RDL panel level packaging technology at this year's SEMICON Taiwan, which not only can reduce the thickness of chip and power consumption, but also can increase the output of chip packaging...
ITRI and Japan’s LINTEC Codevelop Solution Coated Gas Barrier Technology
TAIPEI, Taiwan - ITRI and LINTEC have successfully developed the solution coated gas barrier technology that possesses outstanding gas barrier and optical properties. As opposed to the conventional PECVD process, this technology adopts a coating process that effectively reduces costs and time required in manufacturing and eases the mass production of flexible displays...
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