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Market for Power Semiconductors in Automotive to Rev Up by $3 Billion by 2022
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Published: Jan 19,2017
More than Six Billion Smartphones by 2020
The global smartphone installed base will grow from four billion in 2016 to more than six billion smartphones in use by 2020, according to new analysis released today by IHS Markit. Messaging and communications apps such as Line and Whatsapp will grow from five billion users in 2016 to 7...
DuPont to Showcase Advanced Wearable Electronics at the Wearable Expo Japan
DuPont Advanced Materials (DuPont) will feature its innovative suite of stretchable electronic inks for wearable electronics and showcase a number of industry collaborations at the upcoming Wearable Expo Japan. With IOT (Internet of Things) penetrating both our workplace and life at home, DuPont bringd electrical printing solutions to enable the digitization of textiles and more...
20% of Physical Access Cards Will Be Replaced By Smartphones By 2020
In 2016, less than 5 percent of organizations used smartphones to enable access to offices and other premises. By 2020, Gartner, Inc. said that 20 percent of organizations will use smartphones in place of traditional physical access cards...
Intel Unveils New Retail Platform and $100M Investment
Intel introduced a new retail solution named “Intel Responsive Retail Platform (Intel RRP)” at NRF 2017. In addition, the company announced to invest more than $100 million over the next five years in the retail industry. The Intel Responsive Retail Platform (Intel RRP), a new horizontal platform, was introduced by Intel CEO Brian Krzanich...
China’s Third-Party Payment Industry to Take a Huge Hit This April, Says TrendForce
According to market research firm TrendForce, the total amount of reserve funds that will transfer from third-party payment providers to the control of the Chinese government is estimated around RMB 500 billion. Starting in April 2017, third-party payment providers in China will have to put their client reserve funds under centralized management of People’s Bank of China (PBoC)...
Rambus Signs Patent License Agreement With Winbond
Rambus Inc. today announced it has signed a broad five-year patent license agreement with Winbond Electronics Corporation, a worldwide leading supplier of specialty memory. This agreement covers the use of Rambus patented memory solutions, including server DIMM chipsets, for Winbond products through 2021...
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