TAICS Signs Agreement with NGMN for 5G Cooperation
TAIPEI, Taiwan － TAICS (Taiwan Association of Information and Communication Standards), and NGMN(Next Generation Mobile Networks) today signed a agreement at Taipei 5G Summit. Two sides committed to co-develop 5G technology...
Delta Unveils Modular 500kVA UPS and 120kW RowCool at CeBIT 2016
Delta unveiled today, at DatacenterDynamics CeBIT 2016, new power and cooling technologies with industry-leading power capacity for high-density and large-scale green datacenters. Delta debuts the Modulon DPH series 500 kVA modular UPS featuring both the world’s highest power capacity and power density per module at 55kVA and 22...
ASE Showcases Its Leading IC Assembly Technology at SEMICON China 2016
TAIPEI, Taiwan － Advanced Semiconductor Engineering, Inc (ASE), announced it will be showcasing its System in Package (SiP) solutions in consumer and automotive applications at SEMICON China, scheduled to take place in Shanghai, China, from March 15 to 17, 2016...
Global AMOLED Panel Production Capacity to Increase 19.1% YoY in 2016, TrendForce Says
According to WitsView, a division of TrendForce, the global AMOLED panel production capacity by area will reach 7.9 million square meters in 2016, representing a 19.1% year-on-year increase. As panel makers worldwide continue to expand their AMOLED production, the total capacity for 2018 is forecast at 14...
Lattice, MediaTek Joint Release the Most Power Efficient 4K Video Solution Over USB Type-C
Lattice Semiconductor Corporation and MediaTek today announced the joint release of power-efficient reference designs that drive 4K UHD over a USB Type-C connector. Lattice’s USB Type-C port controllers and MHL transceivers can easily be paired with MediaTek’s Helio X20, the world’s first mobile processor with Tri-Cluster CPU architecture and ten processing cores (Deca-core)...
M31 Announces Its Release of TSMC's 28HPC+ ULL SRAM Compilers for the Smart Devices
HSINCHU, Taiwan — M31 Technology Corporation announced today its release of TSMC's 28HPC+ ULL SRAM Compilers for the Intelligent Device Market. These IP cores will enable designers to realize the features and benefits of a low power, high performance, and cost effective SoC design...
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