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Advantech Named Microsoft Global IoT Valued Partner, Distributor Extended in EMEA
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Published: Nov 20,2015
Growth of 3D IC technology May Shed Light for Taiwan Semiconductor Industry
Worldwide semiconductor demand has continued to grow with manufacturing processes moving towards miniaturization. To consolidate their market share and enhance their supply capabilities through cost reduction, leading semiconductor companies have continued to invest in new generation manufacturing processes or expanded existing production lines while conducting vertical and horizontal integration in the supply chain...
200 Companies Join the Third Party Applications Development of Pepper
TAIPEI, Taiwan — According to Nikkei, there are about 200 companies participate the third party applications development of Pepper. One of which is the human resource company Recruit Holdings from Japan. Needed technical parameters will be announced by SoftBank Group...
Castec, Universal Robots Jointly Develop Mobile Industrial Robots
TAIPEI, Taiwan － Castec, a Taiwanese professional industrial equipment manufacturer, launches a smart industrial robot which integrated with Universal Robots’ mechanical arm. It is equipped with computer-integrated manufacturing system (CIM), and automatically fed functions...
N.A. Semiconductor Equipment Industry Posts October 2015 B/B Ratio of 0.98
North America-based manufacturers of semiconductor equipment posted $1.33 billion in orders worldwide in October 2015 (three-month average basis) and a book-to-bill ratio of 0.98, according to the October EMDS Book-to-Bill Report published today by SEMI...
NVIDIA Releases the 1.0 Version of Two VR Software Development Kits
Delivering VR is a complex challenge, especially since immersive VR requires seven times the graphics processing power compared to traditional 3D apps and games. Today, NVIDIA officially released the 1.0 version of two powerful VR software development kits (SDKs): NVIDIA GameWorks VR and NVIDIA DesignWorks VR...
Altera Discloses Heterogeneous SiP Devices that Integrate HBM2 DRAM with FPGAs
Altera Corporation today disclosed the industry’s first heterogeneous System-in-Package (SiP) devices that integrate stacked High-Bandwidth Memory (HBM2) from SK Hynix with high-performance Stratix 10 FPGAs and SoCs. Stratix 10 DRAM SiP represents a new class of devices that are specifically architected to meet the most demanding memory bandwidth requirements in high-performance systems...
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