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Acer Tops the Monitor Market in Western Europe, Asus Participates in Fun Guandu
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Published: Oct 27,2015
MasterCard and NXP Partner to Bring Payments to Any Device
NXP Semiconductors N.V. today announced a collaboration with MasterCard to simplify the on boarding of secure element-based devices by integrating NXP’s Loader Service solution into MasterCard’s payment ecosystem. Through MasterCard’s new program, which aims to enable any IoT device to become a payment device, the companies are revolutionizing how OEMs and banks deploy secure “pay” solutions to the market...
Advantech's UTC and POS Series Systems Support Windows 10 for the IoT
TAIPEI, Taiwan – Advantech announced that it’s all-in-one touch computers (UTC series) and point-of-sales terminals (POS series) support Microsoft’s Windows 10 operating system for the Internet of Things (IoT). Microsoft’s Windows 10 for the IoT will be used to power a range of intelligent connected units...
Hitachi Made Hitachi Hi-Rel in India a Wholly-Owned Subsidiary, Aiming PE Business
Hitachi, Ltd. announced today that it has made Hitachi Hi-Rel Power Electronics Pvt. Ltd. (“Hitachi Hi-Rel”), a subsidiary that manufactures and sells power electronics (PE) products in the Republic of India, a wholly-owned subsidiary of Hitachi...
AUO Reports Net Profit of NT$3.38 billion for Q3 2015, Downs 3.3% of QoQ
HSINCHU, Taiwan － AU Optronics Corp. (AUO) today held its investor conference and announced its unaudited consolidated financial results for the third quarter of 2015. Consolidated revenues in the third quarter of 2015 were NT$89...
Acer Ranks No. 1 in Retail Monitor Market Share for Western Europe
TAIPEI, Taiwan － Acer has increased its monitor market share in Western Europe to reach the No. 1 position with 17.5% market share for retail sell-out in Q3 2015, according to CONTEXT SalesWatch Distribution. For the gaming monitor market in Western Europe...
Imec, Ghent University Demo Thermoplastically Deformable Electronic Circuits; Philips Testing in LED
At Meeting of the International Microelectronics Assembly and Packaging Society (IMAPS 2015), imec and CMST (imec’s associated lab at Ghent University) present a novel technology for thermoplastically deformable electronics enabling low-cost 2...
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