BOE Jumps to No. 4 in Ranking of TV Panel Suppliers, Says TrendForce
The latest large-size panel shipment report by WitsView, a division of TrendForce, reports that TV panel shipments totaled 24.47 million units in September, representing a monthly increase of 9.9% and a year-on-year increase of 13...
Toshiba, SanDisk Start Equipment Installation at Yokkaichi's New Fab 2
Toshiba Corporation and SanDisk Corporation today announced the start of equipment installation in the New Fab 2 facility at Yokkaichi Operations. New Fab 2 is primarily intended to provide the clean room space necessary to transition a significant portion of the current Yokkaichi 2D NAND capacity to 3D flash memory...
Intel to Expand Production of 3D NAND in Dalian China
Intel announced plans to increase its investment in non-volatile memory technology to better serve customer needs and keep pace with the strong demand for Intel Solid State Drive solutions. Projecting the SSD technology will become a main driving force of Intel’s core computing business, and a key part of Intel’s strategy to be a foundational supplier of the infrastructure that powers the smart, connected world...
Micron Announces New NOR Flash memory, Winbond Licensed First
Micron Technology today announced XTRMFlash memory, a faster NOR flash solution designed to revolutionize the way the electronics industry develops systems to meet the demand for "instant-on" performance and fast system responsiveness in automotive, industrial and consumer applications...
UL Establishes PCB Performance Testing services Lab in Taiwan
TAIPEI, Taiwan － UL today offically opened its printed circuit board performance testing services laboratory in Taipei. With the UL746 and UL796 safety certification, UL is going to provide a more complete product specification testing and inspection services for the local printed circuit board firms...
China and AMD Form Chips Assembly & Testing Joint Venture
TAIPEI, Taiwan － Chinese Nantong Fujitsu Microelectronics Co., Ltd. announced the acquisition of two Advanced Micro Devices（AMD）foundries located in Suzhou and Penang, Malaysia, paying for $370 million. They will finish the transaction in the first half of 2016 and create a joint venture of semiconductor assembly and test...
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