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Imec, SPTS Collaborate on Critical Processes for 3D IC Wafer Stacking

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Published: Jul 15,2015

 

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External Sales of LED Chips Reached $4.35B in 2014

The global market value from the external sales of LED chips grew 18% from US$3.677 billion in 2013 to US$4.35 billion in 2014, according to LEDinside, a division of TrendForce. The share of Chinese companies in the external sales market also rose from 27% in 2013 to 36% in 2014...

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ZTE Outlines Its Strategies of M-ICT Era with IoT and 5G

ZTE has released its strategy for telecom operators to cope with the changing face of the industry, brought about by emerging technologies such as the Internet of Things. Han Ling, ZTE's vice president, said, “Three peaks will appear as the total mobile broadband traffic consumption grows...

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ITRI’S Robotic Tactile Module Equipped 3,000 Sensors

TAIPEI, Taiwan - The institute of Industrial Technology Research (ITRI), a Taiwan-based research institute, yesterday released a new “Robotic tactile module”, which equipped with high-density sensors, can sensor distances and touch from the human’s finger, even stopped by one finger...

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China’s Tsinghua Unigroup to Acquire Taiwan S2-Tek?

TAIPEI, Taiwan — A wave of mergers and acquisitions is reshaping the semiconductor industry, it is widely circulated that Tsinghua Unigroup’s subsidiary, RDA Microelectronics, is interested in acquiring S2-Tek Inc. And it will be given the final verdict at the earliest in this quarter...

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2015 TAIROS Set to Welcome Visitors to Premier Robotic-Tech in Taipei

TAIPEI, Taiwan — 2015 Taiwan Automation Intelligence and Robot Show (TAIROS) is a four-day even that will kick off at Taipei World Trade Center Nangang Exhibition Hall on July 16, which is set to revolve around automation intelligence and robotics technologies, products, equipment and key parts...

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Imec and Panasonic Demonstrate 40nm TaOx-based RRAM Cell

Imec and Panasonic announced today that they have fabricated a 40nm TaOx-based RRAM (resistive RAM) technology with precise filament positioning and high thermal stability. This breakthrough result paves the way to realizing 28nm embedded applications...

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