Rockchip is a China fabless semiconductor company and mobile-internet SOC solution provider founded in Year 2001, focuses on mobile Internet Platform with products targeted on Mobile Internet terminals and portable multimedia entertainment terminals.

Under the terms of the agreement, the two companies will deliver an Intel-branded mobile SoC platform. The quad-core platform will be based on an Intel Atom processor core integrated with Intel's 3G modem technology.

Expanding the offerings in Intel's SoFIA family of integrated mobile SoC platforms for entry and value Android mobile devices, the new quad-core SoFIA 3G part is expected to be available in the first half of 2015. It will be targeted primarily at entry and value tablets.

With today's announcement, the Intel SoFIA family is now made up of three different offerings, including the dual-core 3G version expected to ship in the fourth quarter of this year, the quad-core 3G version that is expected to ship in the first half of 2015, and the LTE version, also due in the first half of next year.

The strategic agreement with Rockchip also enables Intel to ramp new customers with a broader portfolio of products faster.

"The strategic agreement with Rockchip is an example of Intel's commitment to take pragmatic and different approaches to grow our presence in the global mobile market by more quickly delivering a broader portfolio of Intel architecture and communications technology solutions," said Brian Krzanich, Intel CEO.

"We are excited to work with Rockchip. With today's announcement we've added yet another derivative to the Intel SoFIA family, and we expect to have them all in market before the middle of 2015. We are moving with velocity to grow Intel's offerings for the growing global tablet market."

The strategic agreement with Intel expands Rockchip's product portfolio with the addition of the performance and flexibility of the Intel architecture and leading communications solutions.

"We are always looking for innovative ways to differentiate our product portfolio, and the first-of-its-kind collaboration with Intel helps us do this," said Min Li, Rockchip CEO.

"The combination of Intel's leading architecture and modem technology with our leading mobile design capability brings greater choice to the growing global market for mobile devices in the entry and value segments."