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Holtek Rolls out Ultra-Thin Optical Fingerprint Recognition Solutions

By Vincent Wang
Published: Jul 29,2014

TAIPEI, Taiwan — Holtek Semiconductor Inc. held its Q2 investor conference, saying that the year-end revenue and performance will be the same as that of in 2013. Li Pei-ying, Associate General Manager at Holtek, stated out that their wireless charger chipsets will sooner passed the WPC Certification in Q3, which will be put into mass production in Q4. Holtek's ultra-thin optical fingerprint recognition solutions will be thinner in Q4, as well.

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If the iPhone 6 and new iPad are paired with wireless charger as standard equipment, the demand of wireless charger chipsets will be stronger. Li Pei-ying pointed out that their wireless chargers' product conversion efficiency rate reached 73 percent to 74 percent and with low cost, which can rival the leading company TI.

In order to seize present day business opportunities, Holtek has actively entered into the fingerprint recognition technology area. With technical cooperation and a sound investment strategy in its partner company, Gingy Technology, and by using its own Holtek ARM based 32-bit microcontroller, Holtek has been able to successfully produce a full range of ultra-thin optical fingerprint recognition technology products, meeting all the requirements of miniaturisation and low cost.

Holtek optical fingerprint sensors are based on the patented “TrueSecureTM” 3D fingerprint recognition technology, which uses special materials and optical systems, allowing them to obtain a good effective area in an extremely short optical path. The whole optical module thickness can be reduced to 6.5 mm. They incorporate both the advantages of chip types and optical types, have lower costs, a large image capturing area and a small size outline.

The thickness of its second generation solutions have been reduced to 4.9 mm, which will give it an excellent market placement for some special purpose areas such as tablet computers, financial trading and remote control products. For its third generation solutions, which will be released in the Q4 of 2014, the thickness will be reduced to only 3.0 mm, further increasing its competitive advantages in the ultra-thin mobile device market area.

The Holtek optical fingerprint modules subdivide into three categories. The GT series of devices (GT-5110E1/5120E2), the GTU series (GTU-5110B3/B4/B6) , and the GTM series (GTM-5110C2R/C3/C31/C5/C51).

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