Terry Tsao, President of SEMI Taiwan, suggested three advices regarding wafer foundry, packaging and testing industry, and intrument and equipment.

Terry Tsao stated that investing more money in advanced process is needed to maintaining Taiwan's lead status in wafer foundry. TSMC has already developed 16 nanometer (nm) and 10 nanometer advanced process, it had better to team up with those upper stream companies like Applied Materials, Inc. and ASML in view of vying Samsung and Intel.

“In packaging and testing industry front, as IoT (Internet of Things) and Cloud are growing trend while built-in chipset and memory are going micronized, developing 3D IC is imperative that echoed with TSMC Chairperson Morris Chang, saying IoT is one of the big things in the near future.” Terry Tsao added.

To intrument and equipment front, Terry Tsao said that Taiwanese firms did less R&D in semiconductor materials, he who advised Taiwanese companies do more in basic research and development of semiconductor materials. “Taiwan has lots of precision industries, though maybe can't do complete machines at first, still can start from components and subsystems. Penetrating the Niche Market”

SEMICON Taiwan 2014 is expected to be the largest ever in its 19-year history, featuring 1,340 booths and reaching over 40,000 attendees and exhibitors at the Taipei Nangang Exhibition Hall from September 3 to 5.