News
eMemory NeoEE SIP Advances into Automotive Electronics Applications
Published: Oct 21,2014HSINCHU, Taiwan – eMemory announced today the specification upgrade of NeoEE from consumer electronics level (85℃/10 years) to 150℃/10 years, which meets the AEC-Q100 Grade 0 required by automotive electronics.
eMemory, UMC Expand LP-Memory Solutions with 22nm RRAM Qualification
HSINCHU, Taiwan - eMemory and United Microelectronics Corporation today announced that eMemory’s Resistive Random Acce...
eMemory and PUFsecurity Join DARPA Toolbox Initiative
HSINCHU, Taiwan – eMemory today announced a partnership agreement with the U.S. Defense Advanced Research Projects Age...
NeoEE’s high-temperature resistance and stability not only fulfill the application demands of consumer electronics, but also assist clients in developing high-performance products suitable for harsh automotive environment and seize the market opportunities of automotive electronics.
With the global sale of up to 80 million cars each year, the automotive electronics associated applications are expected to bring great market opportunities for wireless communication IC, microcontroller IC (MCU), MEMS controller (MEMS), and power management IC (PMIC).
Targeting the surging demands, eMemory researched and upgraded NeoEE SIP specification to automotive grade of 150℃/10 years to improve data retention capability in high-temperature environment, for fully complying with the stringent requirements by automotive electronics.
NeoEE SIP is developed based on the standard 5V MOS process platform, which is fully compatible with the standard CMOS logic process without the need of additional masks. It is easy to be integrated in high-voltage and Bipolar-CMOS-DMOS (BCD) platforms commonly used for automotive electronics, assisting manufacturers to reduce product development cycle time as well as production cost. The simple structure feature also enables it to be embedded in existing IC for replacing conventional external EEPROM, which is beneficial for surmounting data security issues of communication ICs.
Fully complying with the design rules of foundries, the circuit designs of all eMemory SIP pass complete verifications including operating voltage, high/low temperature, process upper and lower limit to ensure stability.
By utilizing various SIP built-in test mode, eMemory is able to enhance testing precision to further improve production yield, increase cost advantages, and strengthen quality to satisfy various security and reliability application requirements.
eMemory SIP NeoEE has been deployed at leading foundries in logic, low-power, BCD, CIS process, as well as the green process platform developed exclusively by eMemory. In addition, eMemory has successfully embedded NeoEE in 10 new design tape outs in 2014 alone, indicating promising outlook of such technology.
CTIMES loves to interact with the global technology related companies and individuals, you can deliver your products information or share industrial intelligence. Please email us to en@ctimes.com.tw
812 viewed