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Tong Hsing Electronic: Hybrid Integrated Circuit Will be Main Growth Driver in 2015

By Vincent Wang
Published: Nov 04,2014

TAIPEI, Taiwan — Tong Hsing Electronic used to rely on the ceramic substrate as the driving force, however, it's been lower in growth so that the highlight hybrid integrated circuit will be its main growth driver in 2015, according to the company.

Based on the Tong Hsing Electronic's third quarter investor conference report in terms of product percentage, the ceramic substrate is 45 percent, video product is 35 percent, hybrid integrated circuit is 13 percent, the performance of hybrid integrated circuit increased 11.26 percent.

Lu Shao-ping, General Manager of Tong Hsing Electronic, said that the hybrid integrated circuit has been applied in car and hearing aid, and among the first three quarters it increased 27.16 percent year on year. “The hybrid integrated circuit has been mainly used in MEMS sensor to monitor the car direction, as the growing trend in car componets and medical hearing aid, the hybrid integrated circuit will be the main growth driver in 2015.”

Lu Shao-ping pointed out that the company is going to unveil the Direct Bond Copper (DBC) to penetrate the usage in home appliance and solar energy.

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