The strategic alliance of Andes and eMemory will provide customers competitive advantages to exploit opportunities in the growing IoT market, and further expand application ranges into mobile payments, smart home, automotive electronics, and cloud data centers.

The Andes Core S801 secure 32-bit processor elevates the safety of data transfer and storage in embedded applications. Applying Andes Core S801 in System-on-Chip (SOC) designs along with eMemory's one-time programmable (OTP) silicon IPs for security key storage in IoT products, the data security can be greatly enhanced at the minimum cost. Therefore, the new security MCU solutions find the perfect balance between information security and product cost, which can greatly benefit customers to exploit the boundless business opportunities offered by IoT.

To take the lead in the IoT market, the data security of IC hardware and firmware is crucial. Targeting the market potential, Andes launches the Andes Core S8 series products which equip with compact 3-stage pipeline and protected command set for diverse password and anti-tampering applications. Apart from comprehensive protocols for access control, the Andes Core S801 also features an energy-saving core and a secure memory protection unit (Secure MPU), offering hardware protection for program codes and data to prevent side-channel attacks.

Unlike conventional ICs with metal-fuse or poly-fuse based architectures, eMemory's Logic NVM IPs use floating-gate and anti-fuse structures to prevent reverse-engineering, hence effectively protect data from detection and interpolation to enhance information security. The advanced security level of eMemory’s NeoFuse silicon IP has been recognized by the Conditional Access (CA) certification. Moreover, eMemory OTP silicon IPs offer 125℃/10 years industry-grade high-temperature data retention ability, which are ideal for products with strict operational conditions and performance demands.

eMemory's Logic NVM IPs are fully compatible with generic CMOS processes without additional mask layers. They have been extensively deployed in 0.5um~16nm process platforms at worldwide foundries; which offer customers not only a wide range of platform choices for product planning and validation, but also high flexibility of production capacity to maximize manufacturing competitiveness.