Endura and MediaTek have initiated their partnership by taping out eVR and ATC in advanced process nodes. Endura is announce that MediaTek's latest product offerings will include Endura's innovative technology at the lowest process nodes.

Endura's eVR, sVR, and ATC solutions provide unprecedented reduction in bill of material and power usage, while also increasing performance. Endura's technology will provide MediaTek with a competitive advantage in the advanced FinFET nodes through superior power and battery life in a compact solution.

"Our collaboration with Endura Technologies, a pioneer in semiconductor power management, will provide our customer base superior power and performance advantages with a smaller footprint through our system-level solutions delivering high efficiency and ultra-fast transient response," said Dr. Lawrence Loh, Senior Vice President, MediaTek.

Endura's CEO, Taner Dosluoglu, was quoted saying, "We are proud of our new partnership with MediaTek and look forward to the technology advancements we will create together. This technology will introduce the most significant advancement in power management solutions of the last decade and we are excited to see it implemented in MediaTek's products."