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Amkor Technology Opens MEMS Packaging Line in China
Published: Jun 29,2016Amkor Technology today announced it is ramping up a new MEMS and sensor packaging line at its facility in Shanghai. This new, state-of-the-art line will build on the expertise developed at Amkor’s MEMS packaging line in the Philippines, which has produced more than 2.1 billion units of MEMS and sensors since 2011.
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“Because the package influences device performance, MEMS and sensor development requires close collaboration between device technologists and packaging engineers,” said John Donaghey, Amkor’s corporate vice president, Mainstream Products business unit.
“Our Shanghai expansion allows us to better serve customers in Greater China and internationally.”
The new MEMS and sensor line in Shanghai uses Amkor’s standard strip-based processes, and offers leading-edge test protocols to speed time-to-market.
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