Being the first mobile AP in its class designed with the advanced process node, Exynos 7570 is also the first Exynos processor to fully integrate a Cat.4 LTE 2CA modem and connectivity solutions including WiFi, Bluetooth, frequency modulation (FM) and global navigation satellite system (GNSS) in one chip.

“With Exynos 7570, more consumers will be able to experience the performance benefits of the advanced 14nm FinFET process in affordable devices,” said Ben K. Hur, Vice President of System LSI Marketing at Samsung Electronics. “By successfully integrating various connectivity solutions, Samsung is strengthening its competitiveness in the single chip market”

Exynos 7570, with four Cortex-A53 cores in 14nm, delivers 70 percent improvements in CPU performance and 30 percent improvement in power efficiency when compared to its predecessor built on 28nm. The new Exynos also offers a fully connected mobile experience by integrating a Cat. 4 LTE 2CA modem and various connectivity solutions, such as WiFi, Bluetooth, FM radio and GNSS.

Additionally, with design optimization and feature consolidation for components such as PMICs (power management IC) and RF (radio frequency) functionalities, Exynos 7570 reduces the total chipset size by up to 20 percent, giving manufacturers better ability to craft slimmer smartphones.

By supporting screen resolution up to WXGA, record and playback of videos in Full HD, and improved ISP (image signal processor) for 8Mp/13Mp front and back cameras, Exynos 7570 presents a wide array of benefits for smartphone users.