Taipei, Thursday, Oct 29, 2024, 07:31

News

The Merger of ASE and SPIL Has Been Approved By the Unites States Federal Trade Commission

By Korbin Lan
Published: May 19,2017

TAIPEI, Taiwan - Taiwan's largest semiconductor packaging manufacturer, ASE, and SPIL yesterday announced that the two companies had already received written approval from the United States Federal Trade Commission confirmation that the merger of the two companies presents no doubts about fair trade.

More on This

Kandou Announces Zetti, the World’s First Small Scale PCIe 5.0 Ready Transport Layer Switch

Kandou, a global specialist in high-speed, energy-efficient connectivity solutions, has announced Zetti, a PCIe 5.0 transport layer switch with unique...

Kandou Launches World's First Small Form Factor PCIe Transport Layer Switch

Swiss high-speed interface technology provider Kandou recently unveiled the world's first small form factor PCIe Transport Layer Switch, Zetti, at the OCP Global Summit...

ASE and SPIL on June 30 last year signed a shares conversion agreement with the two parties agreeing to employ shares conversion to combine into a new parent company.

ASE stated that they have arranged to begin to establish a new parent company together with SPIL by the end of this year and establish an ASE holding company to begin a new business model.

However, this merger still must undergo review by Mainland China's Ministry of Commerce. Consequently, although ASE and SPIL yesterday received approval of the merger of the two companies from the U.S.A. Federal Trade Commission, they stated that they still must obtain approval from the P.R.C.

(TR/ Phil Sweeney)

CTIMES loves to interact with the global technology related companies and individuals, you can deliver your products information or share industrial intelligence. Please email us to en@ctimes.com.tw

841 viewed

comments powered by Disqus