Micro LED displays have micron-level RGB primary color LED chips arranged in high density arrays on epitaxial substrates. Because single chips are used to form pixels, the screen forms a high density matrix that can replace the luminescent materials in liquid crystal CF and OLED. Using LED as a light-emitting component has excellent functionality and stability, and with falling chip prices and technological advances, it can already be utilized in products.

Nevertheless, PIDA stated that although Micro LED has advantages over AMOLED in manufacturing and costs, the threshold for application in displays is still very high.

PIDA further explained that in general, for blue and green LED chips, gallium nitride (GaN) epitaxial crystals are implanted on a sapphire substrate; consequently, both can be manufactured at the same time. However, for red LED chips, gallium arsenide (GaAs) is used as the substrate; therefore, it is not easy to integrate RGB chips.

For instance, in order to achieve a Full HD effect in Sony CLED panels, two million sets of RGB chips and a total of six million LED chips are used with high-density packaging, and this is a difficult process. As a result, the current opportunities to use Micro LED are more highly concentrated in small and medium-sized panels.

PIDA estimates that the commercial application of Micro LED display technology will not begin until 2020.

(TR/ Phil Sweeney)