TSMC's 22nm ULP/ULL process technology is an optimized version of 28nm process technology which offers advantages of low power consumption/low leakage and high performance while remaining highly cost-effective. Compared with 28HPC+ process technology, TSMC's 22nm ULP/ULL process technology can help reduce chip area by about 5% to 10%, cut power consumption by about 25% at the same operating speed, or increase performance by about 15% under the same power consumption. Customers’ product applications developed on this process technology will cover IoT, GPS, RF, 5G and many other applications.

Suk Lee, TSMC Senior Director, Design Infrastructure Marketing Division, said: "TSMC has a complete IP ecosystem with four application-specific platforms: Mobile, High-Performance Computing, Automotive, and IoT platforms. TSMC’s 22nm ULP/ULL process technology, and supported IP from M31 Technology, will enable customers to realize heightened benefits of performance and power while designing products on these powerful platforms."

H.P. Lin, CEO of M31 Technology, stated that “M31’s IP developed on TSMC 22nm ULP/ULL process, is particularly applicable for IoT and various intelligent IC markets. It will help SoC designers to achieve the goals of lower power consumption, higher performance, and cost effective design. M31 will continue its IP development and validation in TSMC advanced process technologies to provide distinctive and innovative silicon IP to our customers.”

M31 Technology has been a member of TSMC’s IP Alliance Program since 2012 and has developed various IP for TSMC processes, ranging from 180nm to 12nm. In the future, M31 will continue to develop high-quality “boutique IPs” based on the spirit of ultimate technology to the global IC industry.