R.PACK enhances operational efficiency for users of RECIF’s COMPACT and SMART sorters, featuring advanced capabilities and a modern interface designed to streamline wafer sorting processes

Key Features of R.PACK:

• Refined User Interface: The design of R.PACK makes it easier than ever to create recipes and monitor jobs, ensuring smoother operations and increased productivity.

• Seamless Transition: Current users will experience minimal disruption when transitioning to R.PACK, thanks to its intuitive interface that simplifies adoption.

• Ongoing Software Enhancements: R.PACK is built on a forward-compatible framework, with updates released annually to deliver new features and performance improvements. The first major update was rolled out in January 2025, with the next release scheduled for Q1 2026 — part of an ongoing roadmap to enhance user experience and expand system capabilities.

The release of R.PACK reinforces RECIF Technologies’ ongoing commitment to providing high-performance solutions for the semiconductor industry. By focusing on a more intuitive and efficient wafer sorting process, R.PACK marks the first in a series of improvements designed to elevate both the user experience and operational efficiency.

"We believe R.PACK will significantly enhance our customers' workflows and performance," said Thomas Brillouet, the R&D Manager at RECIF Technologies. "By providing enhanced features and a modernized interface, we empower our customers with tools that maximize safety, enhance efficiency, and optimize equipment performance with minimal effort."

The first major update for R.PACK is available now, with additional updates scheduled annually every Q1. R.PACK is compatible with RECIF sorters (COMPACT & SMART) and will fully replace the WISE software by 2027.