The core of these solutions is the RAA604S00 wireless communications System on Chip (SoC), which combines support for communication with smart meters essential to HEMS devices and support for communication with other home devices in a single chip. The first Wi-SUN wireless solution pairs the RAA604S00 wireless communications SoC with the highly-efficient RX63N 32-bit microcontroller (MCU). The second Wi-SUN wireless solution combines the RAA604S00 SoC with the low-power RL78/G1H 16-bit MCU.

In addition, a development environment is available consisting of an evaluation board supplied by Tessera Technology Inc. and Renesas’ communication control software. The combination of the evaluation board mounted with the RX63N MCU and the communication control software is the world’s first to quality as a Home Area Network (HAN) certification CTBU (Certified Test Bed Unit) as defined by the Wi-SUN Alliance. These solutions enable system manufactures to ensure interconnectivity with all third-party devices. They enable system manufacturers to develop HEMS products that comply with the Wi-SUN standard quickly and reliably.

The new RAA604S00 Wi-SUN-compliant wireless communications SoC and the RL78/G1H Wi-SUN-compliant MCU with integrated RAA604S00 both support sub-gigahertz band wireless communication in regions utilizing different frequency bands, such as Europe, North America, and ASEAN countries simply by changing settings in the wireless communication block.