The device includes an integrated active IR proximity sensing circuit which greatly reduces the required number of external components, such as operational amplifier, D/A converter, transistors, resistors and capacitors, thus reducing product area size and BOM costs. The device transmitting power and receiving sensitivity can also be controlled using the application program.

With its integrated EEPROM, which can store application parameters, auto adjustment and calibration functions can be easily implemented. The sensing distance can be also adjusted by the application program as well as having simple development and production features. There is a full range of communication interfaces, including UART, I2C and SPI, which offer a high level of flexibility for communication with different devices, such as MCUs, wireless transmission modules, etc.

The device includes a Flash Program Memory capacity of 2K×14, a Data Memory capacity of 64 bytes, a true EEPROM Memory capacity of 32 bytes and a 12-bit A/D Converter. With regard to packaging, the device is supplied in 8-pin SOP, 16-pin NSOP and 16-pin QFN (3×3) package types.