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Intel to Collaborate with SiTime on MEMS Timing for 5G Modems

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Published: Jul 25,2018

 

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Intel looks to capitalize on future demand for IoTs and 5G, says GlobalData

Intel has been an integral part of telco networks seemingly since the beginning of time. However, changes in how networks are being built are creating new vulnerabilities for the American multinational tech giant as it looks to capitalize on future demand for Internet of Things (IoT) and 5G services, says GlobalData...

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TSMC 7-nm Process Experiencing Heavy Market Demand

TAIPEI, Taiwan - Taiwan Semiconductor Manufacturing Company, Limited (TSMC) last Thursday at a legal briefing stated that their 7-nm chip process has already gone into mass production. They estimate that during the third quarter it will account for 10% of their revenue and then increase to account for 20% of their revenue in the fourth quarter...

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Toshiba Memory Starts Construction of the First Fabrication Facility in Kitakami City, Iwate Prefect

Toshiba Memory Corporation today held a groundbreaking ceremony for the first semiconductor fabrication facility (fab), called K1, in Kitakami, Iwate prefecture, in northeastern Japan. On its completion in autumn 2019, the facility will be one of the most advanced manufacturing operations in the world, dedicated to production of 3D flash memory...

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Cloud Service Providers to Put More Emphasis on Edge Computing, Says TrendForce

Cloud computing platforms have fueled the digital transformation of enterprises in recent years. Public cloud has been playing a key role during the process. While applications of IoT and AI grow increasingly popular, the ecosystem of cloud services and the integration of cloud and edge have emerged as weak points of the market, says TrendForce...

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NEC Provides Demo System Utilizing MEC to DOCOMO 5G Open Lab Yotsuya

NEC Corporation announced the provision of a demo system for intrusion detection solutions utilizing Multi-access Edge Computing (MEC), a network architecture concept for next-generation communications, to DOCOMO 5G Open Lab Yotsuya, a 5G technology verification center run by NTT DOCOMO, INC...

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Sony Releases Stacked CMOS Image Sensor for Smartphones with 48 Effective Megapixels

Sony Corporation today announced the upcoming release of the IMX586 stacked CMOS image sensor for smartphone cameras. The new sensor features 48 effective megapixels, the industry’s highest pixel count. The new product achieved a world-first ultra-compact pixel size of 0...

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