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LEDs Took Half a Billion Tons of Carbon Dioxide From the Sky in 2017, IHS Markit Says
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Published: Dec 22,2017
SEGA Entertainment and Acer’s StarVR Introduce Premium VR Arcade Experiences to Japan
SEGA Entertainment and premium Virtual Reality (VR) solutions provider StarVR today announced its collaboration to bring StarVR arcade experiences to existing SEGA Game Center locations throughout Japan. StarVR will work with SEGA Entertainment to roll out its industry-leading headset and VR arcade experiences across the country, at three SEGA arcade locations by March 2018 and at more than ten locations by the end of the year...
China’s JHICC, Innotron Memory and Tsinghua Unigroup Emerge As Major Domestic Suppliers
TrendForce’s latest report outlines the landscape of China’s dynamic and fast-growing semiconductor industry, and reveals that the memory segment will be a focus for the industry, considering that China now heavily relies on imported semiconductor components, and that semiconductor is a sensitive sector which may have potential applications in national security...
Global Mobile Industry Ready to Start Full-Scale Development of 5G NR
Today the 3GPP TSG RAN Plenary Meeting in Lisbon successfully completed the first implementable 5G NR specification. AT&T, BT, China Mobile, China Telecom, China Unicom, Deutsche Telekom, Ericsson, Fujitsu, Huawei, Intel, KT Corporation, LG Electronics, LG Uplus, MediaTek, NEC, Nokia, NTT DOCOMO, Orange, Qualcomm Technologies, Inc...
Broadcom Announces Industry’s First Silicon-Proven 7nm IP for ASICs in Deep Learning and Networking
Broadcom today announced the industry’s first silicon-proven 7nm intellectual property (IP) for an ASIC platform targeting deep learning and networking applications. Based on TSMC 7nm process technology, the platform offers best-in-class IP cores which include high speed SerDes, HBM PHY, Die2Die PHY, mixed-signal IP, and foundation IP such as standard cells, SRAM, TCAM memory, and I/O cells...
UMC Announces Availability of 40nm SST Embedded Flash Process, Toshiba Expected to Utilize
HSINCHU, Taiwan - United Microelectronics Corporation today announced the availability of the company’s 40nm process platform that incorporates Silicon Storage Technology’s (SST) embedded SuperFlash non-volatile memory. The newly available 40nm SST process features a 20% reduction in eFlash cell size and 20-30% macro area over UMC’s mass production 55nm SST technology...
TriLumina to Demonstrate 3D Solid-State LiDAR Using Its VCSEL Illumination Solutions at CES 2018
At CES 2018, TriLumina will demonstrate multiple use cases for its innovative 940 nm VCSEL illumination modules, including a novel solid-state 3D LiDAR system powered by its illumination modules, which will be showcased at the company's Suite at the Westgate Hotel as well as in the Leddar Ecosystem Pavilion...
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