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STMicroelectronics Enables Innovative Social-Distancing Applications with FlightSense ToF Sensors
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Published: Aug 13,2020
Samsung Announces Availability of its Silicon-Proven 3D IC
Samsung Electronics today announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes. Leveraging Samsung's through-silicon via (TSV) technology...
AUO President Frank Ko Presents Online Keynote on “Display Innovations in the New Normal Economy”
HSINCHU, Taiwan – At the Display Week 2020 online exhibition, Dr. Frank Ko, AUO President and Chief Operating Officer, delivered an online keynote speech titled “Display Innovations in the New Normal Economy”. According to Ko, the COVID-19 pandemic has not only threatened people’s health but also exerted an adverse impact on areas such as work, consumption, living and industry...
Acer Reports July Consolidated Revenues of NT$23.24B, Up 26.9% YoY
TAIPEI, Taiwan - Acer announced its consolidated revenues for July at NT$23.24 billion, up 26.9% year-on-year (YoY). For year-to-July, consolidated revenues were NT$137.70 billion, growing by 7.5% YoY. Work-from-home and online learning needs remain strong, and market demand is higher than supply...
China's Smartphone Market Narrowed its Decline to -10.3% in Q220
According to the IDC Quarterly Mobile Phone Tracker, 87.8 million smartphones were shipped in China during the second quarter of 2020, down 10.3% year-on-year. Evidently, consumer sentiment was a challenge but this was still a narrower figure compared to the first quarter's 20...
Intel’s Stumble in Leading-edge Chips Race Gives Rivals an Opportunity to Catch up, Says GlobalData
Intel has fallen behind in its ability to make commercially ready, leading-edge chips in sufficient volumes, opening the door to its main rivals, AMD and Nvidia, says GlobalData. Intel’s recent bombshell that it has stumbled - yet again - in the production of its 7-nanometer (nm) parts was a shock to the industry nonetheless...
MediaTek and Intel Advance Partnership to Bring 5G to Next Generation of PCs
HSINCHU, Taiwan –MediaTek today announced advances in its collaboration with Intel to bring 5G experiences to next-generation PCs with the successful development and certification of its 5G modem data card. MediaTek’s T700 5G modem, which will be used to bring 5G connectivity to Intel-powered PCs, completed 5G standalone (SA) calls in real world test scenarios...
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