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NEC and D-Wave Begin Joint Quantum Product Development, Marketing and Sales
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Published: Jun 18,2020
Epistar and Lextar to Jointly Establish A New Holding Company
TAIPEI, Taiwan - Epistar Corporation and Lextar Electronics announce the two companies will jointly establish a holding company A (tentative name) via share conversion, which was approved in the board of directors’ meetings of Epistar and Lextar respectively today...
Automotive IC Market Forecast With Strongest CAGR Through 2024
IC Insights released its June Update to the 2020 McClean Report earlier this month. This Update indicated that automotive IC segment to show robust average annual growth but still hold less than a 10% share in 2024. Communications and Computer segments remain largest applications...
NOR Flash ASP to Potentially Drop in 2H20 as Inventory Pressure Mounts
According to the latest investigations by the DRAMeXchange research division of TrendForce, NOR Flash buyers found that their inventories were low and stepped up their procurement efforts as they anticipated the growing risk of COVID-19 causing disruptions in the supply chain...
Taiwan Prepared for the Post-Covid-19 Era With Emerging Technologies
TAIPEI, Taiwan - The Covid-19 pandemic spurs transformation of digital healthcare everywhere. To echo that trend, the Healthcare+ Expo Taiwan will bring together 300 technology giants and healthcare providers to exhibit healthcare-centred applications and solutions powered by AI, IoT, bio-sensor, 8K image tech and 5G to then ignite fresh ideas amongst those with desires to reinvent the way healthcare used to be delivered...
AIC and Parade Jointly Announce Launch of PCI Express Gen 4 Appliance
TAIPEI, Taiwan - AIC Inc. and Parade Technologies today jointly announced the two companies will align on PCI Express Gen 4 retimer technologies to enable the launch of a pioneering PCI Express Gen 4 appliance ideal for composable GPU, AI, HPC workloads...
Cadence Teams with TSMC, Microsoft to Reduce ICs Design Timing Signoff Schedules with the Cloud
Cadence Design Systems today announced the results of a three-way collaboration with TSMC and Microsoft focused on utilizing cloud infrastructure to reduce semiconductor design signoff schedules. Through this collaboration, c...
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