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VIA to Demo VIA Video Wall Mini at InfoComm 2014

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Published: Jun 17,2014

 

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E Ink Spectra won 2014 Outstanding Photonics Product Award

TAIPEI, Taiwan — E Ink Holdings (E Ink), a digital signage and display visionary, today announced that its E Ink Spectra has won the 2014 Outstanding Photonics Product Award with superior product performance. Spectra is the first 3-pigment electronic paper product in the world...

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Asus Will Debut Home Care Robot in 2015

TAIPEI, Taiwan — “Smart home will be an important roadmap of Asus, and cloud, robot are two development strategies.” said Jonathan Tzeng, Vice Chairperson of Asus. “We have been devoting in robot research and development, the first home care robot would be unveiled in 2015...

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HTC and Acer Strive to be the top in Smartphone Market

TAIPEI, Taiwan — HTC and Acer strive to be the top in smartphone market. HTC announced that its new mini version of its flagship M8, HTC One mini 2 smartphone will go on sale in Taiwan later this month, which is expected to strengthen the Taiwanese handset maker's 4G product lines...

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IEI's IPC is Capable of Pattern Recognition

TAIPEI, Taiwan — At COMPUTEX TAIPEI 2014, not only those wearables, IoT, or 2 in 1 laptop drew a lot of attention, IPC (industrial PC) also a highlight at this annual exhibition. IEI Integration Corp. is one of the leading brands of IPC here in Taiwan, their IPC is capable of pattern recognition because of the technology from the company group Morotcon...

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Powerchip: Sooner Will be a Listed Company Again After 2016

TAIPEI, Taiwan — In response to the American touchscreen chipmaker Synaptics said it would buy Renesas SP Drivers (RSP), a display chips supplier for the iPhone for $475 million, potentially winning back Apple as a customer...

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iST Steps Into Solder Joint Reliability Test of Wearable Devices

As wearable applications thrive and lead the trend in the global technology industry, iST announces its formal engagement in solder joint reliability test services of wearable flexible print circuits (FPC), expecting to resolve reliability issues encountered by IC designers and FPC suppliers regarding wearable products, for ensuring the yield in chip assembly of wearable products...

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