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VIVOTEK and CyberLink Announce Strategic Partnership in Facial Recognition
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Published: Jan 16,2020
ROHM’s SiCrystal and STMicroelectronics Announce Multi-Year SiC Wafer Supply Agreement
ROHM and STMicroelectronics today announced it signed a multi-year silicon carbide (SiC) wafers supply agreement with SiCrystal, a ROHM group company having a top share of SiC wafers in Europe. The agreement governs the supply of over 120 million dollars of advanced 150mm silicon carbide wafers by SiCrystal to STMicroelectronics during this period of demand ramp-up for silicon carbide power devices...
Asia-Pacific Scientists Join Forces for the First Comprehensive Map of a Human Brain
Scientists from Taiwan initiated an international coalition that will produce the first comprehensive map of the neuron network of a human brain, with ultra-high resolution and in three dimensions. The coalition now grows to a network involves over 1,000 researchers from Singapore, Australia, China, Japan, Korea and Taiwan...
Samsung Acquires TeleWorld Solutions to Accelerate U.S. 5G Network Expansion
Samsung Electronics today announced the completion of an agreement to acquire TeleWorld Solutions (TWS), a network services provider headquartered in Chantilly, VA. TWS provides network design, testing and optimization services to mobile service and cable operators, equipment OEMs and other companies across the U...
M31 Wins Customers’ Choice Award for Automotive IP Paper at TSMC OIP Ecosystem Forum
HSINCHU, Taiwan –M31 Technology announced that it has received a Customers’ Choice Award for a technical paper focused on IP for automotive applications at TSMC 2019 Open Innovation Platform Ecosystem Forum. The paper, titled “A New Era of MIPI D-PHY and C-PHY in Automotive Electronic Applications,” was developed and presented by Sanco Feng, Technical Manager at M31...
IC Insights: China Only Region to Register Pure-Play Foundry Market Growth in 2019
IC Insights said that the China market was the only major region that showed an increase in pure-play foundry sales last year. Moreover, the European and Japanese pure-play foundry markets each displayed a double-digit decline in 2019...
Imec Demonstrates Scalable III-V and III-N Devices on Si Targeting beyond 5G RF Front-End Modules
Imec presents the first functional GaAs-based heterojunction bipolar transistor (HBT) devices on 300mm Si, and CMOS-compatible GaN-based devices on 200mm Si for mm-wave applications. The results demonstrate the potential of both III-V-on-Si and GaN-on-Si as CMOS-compatible technologies for enabling RF front-end modules for beyond 5G applications...
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