Samtec Announces Over 200,000 Symbols & Footprints for Its interconnect Products
Samtec, a global manufacturer of interconnect solutions, announced that it now has over 200,000 symbols & footprints for its products to accelerate the design process for engineers. Engineers spend days creating digital models for each component on their circuit boards, such as symbols and footprints...
AUO and Samsung Jointly Enter the Premium Home Electronics Market with 8K Bezel-less TV Displays
HSINCHU, Taiwan – AUO announced today that its 65- to 85-inch 8K Bezel-less ultra-high screen ratio LCD TV panel has been adopted by Samsung, and the two will jointly enter the premium home electronics market. AUO’s 8K bezel-less TV displays equipped with 8K (7,680 x 4,320) ultra-high resolution 16 times higher than that of full HD...
Taiwan’s MOST Creates “Taiwan Innotech Expo – Future Tech,” a Cross-Agency Endeavor
TAIPEI, Taiwan - The "2020 Taiwan Innotech Expo" focuses on securing Taiwan's position as a technology trading hub by strengthening international relations. This year, the event will be jointly hosted by the Ministry of Science and Technology and Ministry of Economic Affairs...
RF/Microwave to Lead Power Transistor Recovery in 2021
The total power transistor market is expected to fall 7% in 2020 because of the Covid-19 virus crisis, but sales are forecast to rebound 7% next year and reach a new record high in 2022, says O-S-D Report. After three straight years of record-high sales...
Cadence and UMC Certify mmWave Reference Flow on 28HPC+ Process for Advanced RF Designs
HSINCHU, Taiwan - Cadence Design Systems and United Microelectronics Corporation announced that the Cadence millimeter wave (mmWave) reference flow has achieved certification for UMC’s 28HPC+ process technology. With this certification, mutual Cadence and UMC customers have access to an integrated RF design flow that accelerates time to market...
M31 Completes the Comprehensive Physical IP Platform on TSMC 22nm Process
HSINCHU, Taiwan – M31 Technology announced the completion of a comprehensive physical IP platform on TSMC 22nm process, which includes 22nm ultra-low power (22ULP) and 22nm ultra-low leakage (22ULL) process technologies. M31 offers solutions of Foundation IP, Memory IP, High-Speed Interface IP, and Analog IP for customers’ SoC design requirements...
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