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UMC Obtains LEED Gold Certification for Its Xiamen Based Fab 12X

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Published: Oct 30,2017

 

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Facial Recognition Reinforces Physical Retailers' Advantages and Reduces Disadvantages, MIC Says

The progress in innovation and technology is redefining the retail industry which has undergone continuous transformation. Networks, mobile platforms, social media, and live shopping have changed consumers' shopping habits, according to Taipei-based IT research institute MIC (Market Intelligence & Consulting Institute)...

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Taiwan’s Apple Supply Chains Heat Up for Upsurge of iPhone X Pre-orders

TAIPEI, Taiwan - According to a Taiwan Economic Daily News report, because pre-orders of the iPhone X have exceeded expectations, Apple has urgently requested assistance from related supply chains in Taiwan. Currently in addition to be a hot selling item for pre-order in the American market, pre-orders have also exceeded expectations in the greater China region in Asia...

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HERE and Mitsubishi Electric Team up to Offer Advanced Location Services for Autonomous Cars

HERE Technologies and Mitsubishi Electric Corporation announced their intention to link their technologies for autonomous vehicles into a powerful integrated offering for automakers. According to their preliminary agreement, the companies aim to offer services to support cars with ADAS (advanced driver assistance systems) on the road today right through to the fully autonomous vehicles of the future...

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Taiwanese Brands to Showcase Their Latest Automobile Technology at AAPEX 2017

Taiwan’s leading auto parts brands will showcase their latest automobile technology at the Taiwan Excellence Pavilion at AAPEX 2017, being held October 31-November 2 at the Sands Expo in Las Vegas, Nevada. With the increasing importance of telematics and vehicle safety issues, Taiwan is leveraging its outstanding ICT technology and is ready to provide superior quality solutions for global buyers...

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VIA Launches VIA SOM-9X20 Featuring Qualcomm Snapdragon 820 Embedded Platform

TAIPEI, Taiwan - VIA Technologies, Inc., today announced the launch of the VIA SOM-9X20 system-on-module (SoM) powered by the Qualcomm Snapdragon 820 embedded platform. The VIA SOM-9X20 is an ultra-compact SoM that harnesse...

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Winbond Introduces TrustME Secure Flash Memory Implementing the TCG DICE Architecture

TAICHUNG, Taiwan - Winbond Electronics Corporation today announced an expansion of its TrustME Secure Flash products portfolio based on the Trusted Computing Group (TCG) Device Identifier Composition Engine (DICE) Architecture specification...

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