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STMicroelectronics Acquires Power Amplifier and RF Front-End-Module Specialist SOMOS Semiconductor
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Published: Oct 19,2020
Mitsubishi Electric to Launch “EcoAdviser” AI-enabled Energy Software
Mitsubishi Electric Corporation (announced today that the company’s new EcoAdviser data-analysis and diagnostic software (MES3-EAP1-AI) for increased energy savings at manufacturing facilities will be released on October 26...
AUO to Take Advantage of Smart Vertical Opportunities from 5G + AI Digital Transformation
HSINCHU, Taiwan – The COVID-19 pandemic has accelerated the pace of digital transformation for the entire industry. Innovative fusion of 5G, AI and display technologies is now crucial for turning crisis into opportunity in the post-pandemic era...
MicroSAM – The New Microcontroller-Agnostic Module Form Factor for the Enablement of Smart Sensors
PICMG, a leading consortium for the development of open embedded computing specifications, announces the ratification of the MicroSAM specification. MicroSAM is a new microcontroller-agnostic, ultra-small form-factor module for the enablement of smart sensors...
AU Optronics Reports September 2020 Consolidated Revenue of NT$26.08 Billion, 9.2% YoY
AU Optronics Corp. today announced its unaudited consolidated revenue of NT$26.08 billion for September 2020, up by 7.5% month-over-month and 9.2% year-over-year. Consolidated revenues in the third quarter of 2020 were NT$73.23 billion, up by 15...
Acer Reports September Consolidated Revenues of NT$29.51 Billion, Record High in 72 Months
TAIPEI, Taiwan – Acer announced today its consolidated revenues for September at NT$29.51 billion, reaching a record high in 72 months, and up 21.3% year-on-year (YoY) or 8.2% month-on-month. Preliminary consolidated revenues for the third quarter of 2020 reached NT$80...
Imec Presents Alternative Metals in Advanced Interconnect and Contact Schemes As a Path to 2nm Nodes
At the 2020 International Interconnect Technology Conference, imec demonstrates for the first time electrically functional 2-metal-level interconnects fabricated with Ru semi-damascene and airgap technology showing a long lifetime and good mechanical strength...
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