Q3 2016 Taiwan IC Revenue Totaled NT$659.6 Billion
TAIPEI, Taiwan - According to The Taiwan Semiconductor Industry Association (TSIA) that Q3 2016 Taiwan IC revenue as a whole (including design, manufacturing, packaging and testing) totaled NT$659.6 billion(US$20.7B), 9.7% growth on-quarter and up 14...
Notebook Shipments to Drop 4.5% in 2017, TrendForce Projects
Global notebook shipments for 2016 is estimated to decline by 4% compared with the prior year to around 157.9 million units, reports global research firm TrendForce. Notebook sales this year have been constrained by rising prices and supply shortages in the component markets...
UMC Holds Grand Opening Ceremony for New 12-Inch Wafer Fab in China
United Microelectronics Corporation (UMC) today celebrated the grand opening of United Semi, UMC’s 12-inch joint venture wafer fab in Xiamen China. The fab was completed in record time, realized volume production for customer products merely 20 months after groundbreaking in March of 2015...
AUO Opens G6 LTPS Fab with the World’s Fastest Mass Production
TAIPEI, Taiwan - Taiwan LCD manufacturer AU Optronics Corp. (AUO) today formally opened its G6 LTPS TFT-LCD Fab in Kunshan, China. The factory features the fastest global speed for LTPS TFT-LCD mass production. It is estimated that it will have a monthly capacity of 25,000 glass substrates during the first phase which will be fully loaded...
AUO's G6 LTPS Fab in Kunshan Announces Its Grand Opening with Successful Mass Production
HSINCHU, Taiwan – AU Optronics Corp. (AUO) today announced the grand opening of its G6 LTPS (Low Temperature Poly-silicon) TFT-LCD Fab in Kunshan and success in entering mass production, making it the fastest LTPS fab to have achieved equipment move in, light up, and mass production, setting a new industry record...
eMemory’s NeoFuse IP Verified in TSMC 10nm FinFET Process
HSINCHU, Taiwan – eMemory today announced the successful demonstration of its security-enhanced NeoFuse IP in TSMC’s 10nm FinFET process, along with IP design kits available to customers for product design-in. Security concerns associated with high-level chips heighten the need for security functions in logic NVM IP with leading-edge process nodes...
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