Taiwanese Branded Vendors Delaying New Product Shipments Until 2H 2016
The Taiwanese smartphone shipments reached around 86.0 million units in the first quarter of 2016, down 23.1% sequentially, according to MIC (Market Intelligence & Consulting Institute), a Taipei-based ICT research institute. MIC noted that the sequential decline was attributed to the sluggish iPhone shipments and the delayed launch of Taiwanese branded vendors` flagship products...
Intel Extreme Masters Season 11 to Unfold on Predator Monitors
TAIPEI, Taiwan - Acer’s Predator XB241H gaming monitor has been chosen as the official monitor of the Intel Extreme Masters (IEM) pro gaming tour, Season 11. Providing a best-in-class gaming experience inside-and-out, the Predator XB241H builds on Acer’s industry-leading display technologies, which has been widely praised by gamers worldwide...
OSRAM and MLS to Carve Out Their Positions in LED Lighting Market with LEDVANCE Deal
German-based lighting manufacturer OSRAM has agreed to sell its lamp business unit LEDVANCE to a Chinese consortium that is led by IDG Capital Partners and includes LED manufacturer MLS and Yiwu State-Owned Assets Operation Center...
FOVE to Debut Its Industrial Eye-tracking VR Headset
FOVE Inc. announced today that they will be debuting the new industrial design for their eye-tracking VR headset this month in southern California. Set to premier at both Comic-Con and SIGGRAPH2016, FOVE’s new design showcases the company’s continued emphasis on bringing eye-tracking to virtual reality while remaining a lightweight VR headset...
Keysight Joins Next-Gen Mobile Networks Alliance to Advance 5G Technology
Keysight Technologies today announced that it has joined the Next Generation Mobile Networks (NGMN) Alliance. As a member of NGMN, Keysight will work closely with the growing community of innovative global mobile network operators, manufacturers and research institutes involved with 5G development and deployment...
Toshiba Starts Sample Shipment of 64-Layer 3D Flash Memory
Toshiba Corporation today unveiled the latest generation of its BiCS FLASH three-dimensional (3D) flash memory with a stacked cell structure, a 64-layer device that will be first in the world to start sample shipments today. The new device incorporates 3-bit-per-cell (triple-level cell, TLC) technology and achieves a 256-gigabit (32-gigabytes) capacity, an advance that underscores the potential of Toshiba’s proprietary architecture...
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