SYSGO and CoreAVI Collaborate to Support Cortex-A72-based CPU for Safety-Critical Systems
Core Avionics & Industrial Inc. ("CoreAVI") and SYSGO announced today their collaboration to support ARM's Cortex-A72-based CPU for next gen safety-critical graphics and compute applications. CoreAVI and SYSGO will work together to ensure the interoperability of CoreAVI's new COTS-D 3U VPX NXP LX2160-based SBC0003 Single Board Computer hardware design IP with SYSGO's safety-critical PikeOS RTOS...
Chailease Leads the Pack in 2019 Rankings of Taiwanese EPC Suppliers, Says TrendForce
According to the latest edition of the 2020 Solar Powering Taiwan: Special Report, published by the EnergyTrend research division of TrendForce, the Taiwanese PV market reached newly installed capacity of 1,411MW in 2019, which was 94% of the way to meeting its 1...
Faraday Delivers System-Level ESD Protection Service to Reduce ASIC Time-to-Market
HSINCHU, Taiwan - Faraday Technology today introduced its system-level ESD (electrostatic discharge) protection service. Faraday has successfully deployed this service in many ASIC projects, including factory automation applications, further shortening production lead times...
Embedded Computing on the Frontlines of Pandemic Response and Prevention
AAEON is helping to power the pandemic response with the BOXER-6638U rugged embedded box PC. Featuring Intel Core i3 processors, the BOXER-6638U brings the power of industrial computing to mobile X-ray machines, used to perform chest X-ray scans of suspected COVID-19 patients...
TSMC and NCTU Work on Wafer-scale One-atom-thick Insulating Layer Technology
TAIPEI, Taiwan - Under long-term support from the “Taiwan Consortium of Emergent Crystalline Materials” (TCECM) program of the Ministry of Science and Technology (MOST), Taiwan, a research team at National Chiao Tung University (NCTU) collaborated with Taiwan Semiconductor Manufacturing Company (TSMC) to form an industry-university joint research team, reporting a breakthrough in the synthesis of one-atom-thick boron nitride (BN)...
Samsung Begins Mass Production of the Fastest Storage for Flagship Smartphones
Samsung Electronics today announced that it has begun mass producing the industry's first 512-gigabyte (GB) eUFS (embedded Universal Flash Storage) 3.1 for use in flagship smartphones. Delivering three times the write speed of the previous 512GB eUFS 3...
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