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SEMICON Taiwan 2014 to Showcase the Next 3 big Things

By Vincent Wang
Published: Sep 02,2014

John Wei suggested that after developing the fast Internet, the next stage will be developing the fa

TAIPEI, Taiwan — SEMICON Taiwan 2014 will be the highlight of semicondoctor industry this week, which is going to be held at Nangang Exhibition Hall from September 3 to 5. John Wei, Sr. Director at Mobile & Computing BD of TSMC said in the SEMICON Taiwan 2014 press conference that there will be three hot topics of semiconductor industry, including ultra-low power, sensor technology optimization, and advanced packaging.

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John Wei suggested that after developing the fast Internet, the next stage will be developing the fast charging, especially ultra-low power wireless charging technology. “Now users need to charge wrist band, smart watch maybe once in two days, it will be charged on the monthly basis in the future.”

When asked about whether TSMC is fallen behind of UMC in ultra-low power technology, John Wei smiled and said that TSMC has been working hard in this field, “people will soon realize and understand our new technology.”

The second hot topic of the semiconductor industry is sensor technology optimization, “like Seri is a software that allowed information from sensoring by speaking.” John added

John Wei said that the advanced packaging is still important in this cost-driven era with the view that number of layers representing the cost.

What's more, John also considered the IoT (Internet of Things) will be the growth engine of semicondoctor industry in two to five years along with wearables, However, he pointed out that Taiwanese firms are good at manufacturing hardware, but lacking the concept of system integration.

There will be 1,400 booths from 650 firms enrolled in SEMICON Taiwan 2014, and the visitor is estimated to reach 40 thousand people, as well as more than 120 experts will be taken part in 21 forums regarding the market trend and technology, discussing high-tech facility, sustainable, SiP (3D IC embedded), AP, Litho, CMP, MEMS, and IoT.

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