“UMC has been highly successful in producing MEMS products for microphone, accelerometer and environmental sensor applications,” said S.C. Chien, senior vice president of Corporate Marketing division at UMC.

He said that partnering with APM allows UMC to broaden it MEMS addressable market to serve a wider range of customers targeting the growing Internet-of-Things (IoT) sector, such as system companies, module providers and designers of new MEMS chips. This alliance will also provide customers with greater working model flexibility, as APM can provide full turnkey service, MEMS prototyping and small volume manufacturing, while UMC delivers process porting capability for mainstream, volume production MEMS products that are ready to migrate to more productive and cost effective 8” manufacturing.

K.H. Jao, president of APM said, “APM brings over 15 years of MEMS experience in design, manufacturing and packaging to our partnership with UMC. Our flexible process capability and process module blocks address different customized chip requirements including sensor, actuator and microstructure, which enable customers to streamline their unique MEMS IC designs to market.”

“We are excited to cooperate with UMC, and believe the synergies created not only by our two companies’ complementary services, but also by our close proximity in Hsinchu to UMC and numerous semiconductor suppliers, MEMS packaging & testing providers, will provide unmatched speed and supply chain advantages to MEMS customers worldwide.”