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eMemory Receives 2017 TSMC IP Partner Award

Published: Sep 14,2017

HSINCHU, Taiwan – eMemory announced today that it received TSMC’s Open Innovation Platform (OIP) “IP Partner Award” of 2017.

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The company has been honored with this award in the “Specialty Embedded Memory IP” category every year from its inception in 2010. Over the past few years, eMemory has collaborated closely with the TSMC in delivering reliable logic NVM IPs and services across a range of TSMC process nodes.

In the most recent year, eMemory has completed qualifications of its NeoFuse IP on TSMC’s 16nm FFC, 28nm HPC+ and 40nm 6V/8V HV platforms. It has also completed qualifications of NeoEE IP on the foundry’s 130nm BCD and 180nm Logic platforms.

“For years we’ve witnessed eMemory’s persistent efforts in delivering top-notch IPs and services,” said Suk Lee, TSMC Senior Director, Design Infrastructure Marketing Division. “This award recognizes the company’s capabilities of providing reliable IPs as much as its excellent technical support and customer service.”

"The prestige of this award is such that it’s always been a tremendous boost for us to aim for higher year after year,” said Rick Shen, President of eMemory. “It’s been our commitment to being relentlessly innovative and providing best-of-class IPs to clients, and we’ll continue to work closely with TSMC to achieve that."

The partnership between eMemory and TSMC began in 2003. Since then the IP provider has deployed NeoBit, NeoFuse, NeoEE, and NeoMTP across a range of TSMC platforms.

The selection criteria of TSMC’s IP Partner Award includes customer feedback, TSMC9000 compliance, number of customer tape-outs and number of wafers shipped. The award ceremony was held on September 13th in Santa Clara, Calif. U.S., during TSMC’s annual Open Innovation Platform Ecosystem Forum.

To date, over 315 of eMemory’s silicon IPs have been deployed on TSMC’s Open Innovation Platform. In addition, the company has completed more than 1,120 new tape-outs, and over 10 million eMemory-IP-embedded wafers have been shipped on TSMC platforms for a broad range of applications, including IoT, smartphone, automotive, and consumer electronics.

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