Taipei, Sunday, Mar 18, 2018, 23:37


Innolux’s AM miniLED Panels to be Mass Produced in Two Years

Published: Feb 07,2018


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Continental and NVIDIA Partner to Enable Worldwide Production of AI Self-Driving Cars

NVIDIA and Continental today announced they are partnering to create top-to-bottom AI self-driving vehicle systems built on the NVIDIA DRIVE platform, with a planned market introduction starting in 2021. The partnership will enable the production of AI computer systems that scale from automated Level 2 features through full Level 5 self-driving capabilities, where the vehicle has no steering wheel or pedals...

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The China Smartphone Market Declined by 4.9% in 2017

According to preliminary data from the IDC Quarterly Mobile Phone Tracker, the China smartphone market declined 15.7% year-over-year (YoY) in 2017Q4 and 4.9% for the whole of 2017. “In 2017, the minor upgrades that Chinese smartphone companies made to their offerings were not enough to move consumers to splurge on new models, resulting in a general slowdown in the market...

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N-Type Solar Cell Technologies Are Expected to Enter Mass Production in 2018, Says TrendForce

EnergyTrend, a division TrendForce, has recently published a new report Market of Advanced PV Technology. According to the report, requirements outlined in China’s Top Runner Program (3rd phase) will drive solar PV companies to improve efficiency in order to win the biddings on projects...

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Winbond: DRAM and Flash to Remain Stable in 2018

TAIPEI, Taiwan - Winbond on last Friday, February 2 at a legal briefing session explained that supply and demand will remain stable for DRAM and Flash in 2018 and that there will be a trend towards health and upward movement in both markets...

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Mobile System on Chip Designs, Embedded Processing Lift MPU Market

The recently released 2018 edition of IC Insights’ McClean Report shows that the fastest growing types of microprocessors in the last five years have been mobile system-on-chip (SoC) designs for tablets and data-handling cellphones and MPUs used in embedded-processing applications...

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ASE and Cadence Deliver First System-in-Package EDA Solution

KAOHSIUNG, Taiwan - Advanced Semiconductor Engineering, Inc. and Cadence Design Systems today announced they have collaborated to release a System-in-Package (SiP) EDA solution that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages...

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